We design three contest problems covering three distinct areas: system level design, logic synthesis & verification, and physical design. Each problem is handled independently. Contestants can participate in one or more problems.
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3D-ICON: 3D Interlayer Cooling Optimized Network
Mohamed M. Sabry1, Arvind Sridhar2, and David Atienza3
1Stanford University, 2IBM Zurich, 3ESL-EPFL -
Large-Scale Equivalence Checking and Function Correction
Chih-Jen (Jacky) Hsu, Cadence Taiwan, Inc.,Taiwan -
Incremental Timing-driven Placement
Myung-Chul Kim and Jin Hu, IBM Corporation, TX, USA